Flux On Copper Sheet Annealing

30 is a liquid flux that is ideal for soldering copper or brass.

Flux on copper sheet annealing.

Copper s melting point is 1 981 degrees f liquidus and 1 949 degrees f solidus. When brazing copper tube however the annealing of the tube and fitting that results from the higher heat can cause the rated pressure of the system to be less than that of a soldered joint. Superior flux also offers unique soldering fluxes for soldering zinc and aluminum. They consist of wire and cable sheet strip plate rod bars tubing forgings castings and powder metallurgy shapes.

In the soldering process heat is applied to the copper joint where the pipe and fitting meet and the gap between the joint is filled with molten metal. Copper mate removes oxidation and prepares copper lead brass tin stainless steel cast and wrought iron except aluminum for the proper bonding of solder to metal assuring leak tight joints. Now heat the silver sheet in a circular motion until the silver starts to reach annealing temperature or begins to glow a dull cherry red colour. Once the flux is applied you can place the silver sheet on top of the copper sheet ensuring that the solder is face down on the copper sheet.

30 is safer to use than the typical inorganic acid soldering flux. A copper pipe is one of the most common materials used to distribute water throughout the home and copper pipes are typically joined to one another using flux and solder. Keep the flame moving across the full surface of the copper to evenly heat it. Superior flux offers sal ammoniac bars for roofers.

These products made from copper and copper alloys may be heat treated for several purposes such as homogenizing annealing stress relieving and precipitation hardening. A self cleaning lead free soldering flux in a paste form specially formulated for sweat fitting work. Rubyfluid fluxes are used for soldering galvanized steel copper tin and stainless steel roofs. Our rubyfluid flux has been a favorite roof soldering flux for over 100 years.

All post solder residues are water soluble and must be cleaned off with 60 c 140 f water to avoid cleanliness failures. No surface preparation is needed. 30 is mild enough to use with electronic and electrical components.